CL

Chen-Hung Lin

TSMC: 1 patents #2,264 of 4,162Top 55%
📍 Huangpu District, CA: #2 of 2 inventorsTop 100%
Overall (2024): #509,843 of 561,600Top 95%
1
Patents 2024

Issued Patents 2024

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
12165935 Physical vapor deposition process apparatus and method of optimizing thickness of a target material film deposited using the same Ya-Chin CHIU, Ming-Hsien Lin 2024-12-10