Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12156372 | Localized immersion cooling enclosure with thermal efficiency features | M. Baris Dogruoz, Mark Nowell, Yi Tang, Mandy Hin Lam | 2024-11-26 |
| 11935796 | Temperature control for multiple die types in a common package | Mark A. Gustlin | 2024-03-19 |
| 11917793 | Localized immersion cooling enclosure | Mark Nowell, M. Baris Dogruoz, Mandy Hin Lam | 2024-02-27 |