Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12160948 | Integrating graphene into the skin depth region of high speed communications signals for a printed circuit board | Joel Richard Goergen, Scott Hinaga, Jessica Kiefer, Alpesh Umakant Bhobe, D. Brice Achkir +3 more | 2024-12-03 |
| 12074081 | Use of bimetals in a heat sink to benefit heat transfer from high temperature integrated circuit components on a circuit board | Mahesh Daisy, Jerome Henry | 2024-08-27 |