Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11869816 | LED package with multiple test pads and parallel circuit elements | Fu-Bang Chen, Chih-Chiang Chang, Chun-Ming Lai, Wen-Hsing Huang, Tzeng-Guang Tsai +1 more | 2024-01-09 |
| 11869817 | Vertical light emitting diode chip package with electrical detection position | Fu-Bang Chen, Chih-Chiang Chang, Chun-Ming Lai, Wen-Hsing Huang, Tzeng-Guang Tsai +1 more | 2024-01-09 |