Issued Patents 2024
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12074183 | Semiconductor packaging method and semiconductor package device | — | 2024-08-27 |
| 11990398 | Semiconductor package device having chip substrate with pads around photosensitive region | — | 2024-05-21 |
| 11990432 | Semiconductor packaging method and semiconductor package device | — | 2024-05-21 |
| 11948911 | Semiconductor packaging method and semiconductor package device | — | 2024-04-02 |
| 11948960 | Semiconductor packaging method and semiconductor package device | — | 2024-04-02 |
| 11926709 | Method for recycling waste polyester | Huayu Fang, Enbin Zhu, Dubin Wang, Jincheng Chen, Tianyuan Li +3 more | 2024-03-12 |