Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12049557 | Bi-continuos epoxy microstructure for fabrication of degradable thermoset composite used in HTHP downhole conditions | Lei Zhao, Jiaxiang Ren, Peng Cheng | 2024-07-30 |
| 11952531 | Compound grease coating for controlled dissolution of a dissolvable component of a downhole tool | Lei Zhao, Jiaxiang Ren, Tim Dunne, Peng Cheng | 2024-04-09 |