Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12056424 | Simulation of microstructure evolution of material as solved based on exponential time-difference format | Yangang Wang, Jian Zhang, Zhikuang Xin, Yankun Dou, Ningming Nie +3 more | 2024-08-06 |