Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11931993 | Bonding method and bonding device for flexible panel | Jia Deng, Jialin Wang, Rongkun FAN, Shengqiang Wu, Yuanhong Wen +3 more | 2024-03-19 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11931993 | Bonding method and bonding device for flexible panel | Jia Deng, Jialin Wang, Rongkun FAN, Shengqiang Wu, Yuanhong Wen +3 more | 2024-03-19 |