Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12176311 | Micro bump, method for forming micro bump, chip interconnection structure and chip interconnection method | — | 2024-12-24 |
| 12132022 | Semiconductor devices and preparation methods thereof | — | 2024-10-29 |
| 11978698 | Method for forming a semiconductor package structure | — | 2024-05-07 |