Issued Patents 2024
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12148654 | Semiconductor structure including a trench having a high aspect ratio formed by etching and its manufacturing method as applied to formation of a capacitor in the semiconductor structure | MingHung Hsieh | 2024-11-19 |
| 12114478 | Semiconductor structure and method for preparing same | Gongyi Wu, Longyang Chen | 2024-10-08 |
| 12021082 | Enhanced channel strain to reduce contact resistance in NMOS FET devices | Yu-Chang Lin, Chun-Feng Nieh, Huicheng Chang, Hou-Yu Chen | 2024-06-25 |
| 11984472 | Double-sided capacitor structure and method for forming the same | — | 2024-05-14 |
| 11980020 | Semiconductor structure and forming method thereof | — | 2024-05-07 |
| 11935925 | Method for manufacturing semiconductor structure and semiconductor structure | Gongyi Wu, Youquan YU | 2024-03-19 |
| 11916102 | Double-sided capacitor structures and forming methods thereof | Wenjia Hu, Han-Min Wu | 2024-02-27 |
| 11894419 | Double-sided capacitor and fabrication method thereof | — | 2024-02-06 |
| 11877440 | Bit line structure including ohmic contact and forming method thereof | Gongyi Wu, Penghui Xu | 2024-01-16 |
| 11869930 | Method for forming semiconductor structure and semiconductor structure | — | 2024-01-09 |
| 11864378 | Semiconductor device and method for manufacturing semiconductor device | Gongyi Wu, Hongkun SHEN, Qiuhu PANG | 2024-01-02 |