Issued Patents 2024
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12136553 | Opening structure and forming method thereof, contact plug structure and forming method thereof | — | 2024-11-05 |
| 12132076 | Capacitance structure and forming method thereof | — | 2024-10-29 |
| 12119234 | Semiconductor structure and method for manufacturing same | — | 2024-10-15 |
| 12068239 | Semiconductor structure with conductive plug and capacitor array | Jie Liu | 2024-08-20 |
| 12051982 | Method of clamping output current of three-phase power converter | Kai-Wei Hu, Lei-Chung Hsing | 2024-07-30 |
| 12027379 | Package substrate and method of forming the same, package structure and method of forming the same | — | 2024-07-02 |
| 12009324 | Semiconductor structure and method for forming semiconductor structure | — | 2024-06-11 |
| 12002748 | Contact window structure, metal plug and forming method thereof, and semiconductor structure | Jie Liu, Zhan Ying | 2024-06-04 |
| 11990390 | Semiconductor structure | Chih-Wei Chang, Hailin Wang | 2024-05-21 |
| 11961798 | Semiconductor structure and method for manufacturing semiconductor structure | — | 2024-04-16 |
| 11931742 | Carrying module, nucleic acid loading device and use thereof | Songzhen ZHANG, Zefei Jiang, Guangming Wang, Zhiliang Zhou, Qin Yan | 2024-03-19 |
| 11929280 | Contact window structure and method for forming contact window structure | — | 2024-03-12 |
| 11870382 | Matrix power conversion device and control method thereof | Kai-Wei Hu, Lei-Chung Hsing | 2024-01-09 |