Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12098238 | Curable resin, curable resin composition, cured product, electronic device, laminated board material, electronic component encapsulant, and method for producing curable resin | Kensuke HIROTAKI, Hirokatsu Nagura, Kenji Hosoi | 2024-09-24 |