Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12164161 | Stacked-dies optically bridged multicomponent package | David E. Lazovsky, Ankur Aggarwal, Martinus Bos, Subal Sahni | 2024-12-10 |
| 12164162 | Multicomponent photonically bridged assembly | David E. Lazovsky, Ankur Aggarwal, Martinus Bos, Subal Sahni | 2024-12-10 |
| 12124095 | Optical multi-die interconnect bridge with optical interface | David E. Lazovsky, Ankur Aggarwal, Martinus Bos, Subal Sahni | 2024-10-22 |