Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12033903 | High-density microbump and probe pad arrangement for semiconductor components | — | 2024-07-09 |
| 11994925 | Power management and staggering transitioning from idle mode to operational mode | Srinivas Sripada, Chia-Hsin Chen, Avinash Sodani, Atul Bhattarai | 2024-05-28 |