Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12027477 | Method of additively manufacturing an integrated circuit of an interconnect packaging structure | Ioannis Papapolymerou, Premjeet Chahal, John D. ALBRECHT, Michael T. Craton | 2024-07-02 |