Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12011868 | High elastomeric modulus and strength polymer constructs and methods of forming | Eric Baer, Andrew M. Olah, Cong Zhang, Gary Wnek, Chung-Fu Cheng | 2024-06-18 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12011868 | High elastomeric modulus and strength polymer constructs and methods of forming | Eric Baer, Andrew M. Olah, Cong Zhang, Gary Wnek, Chung-Fu Cheng | 2024-06-18 |