Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11999173 | Medium including heat-sensitive medium provided with base material having uneven shape, and adhesive medium bonded to heat-sensitive medium | Keisuke Nishihara, Akira Minami | 2024-06-04 |