Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12100639 | Chip heat dissipation structure, chip structure, circuit board and supercomputing device | Dan Su, Micree Zhan, Tao Zhou | 2024-09-24 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12100639 | Chip heat dissipation structure, chip structure, circuit board and supercomputing device | Dan Su, Micree Zhan, Tao Zhou | 2024-09-24 |