Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12014950 | Method for forming semiconductor structure and semiconductor structure | — | 2024-06-18 |
| 12002601 | Stress-resistant, creep-resistant, high-temperature resistant and high-insulation sheath material for maglev train cable, and manufacturing method and use thereof | Ping Wang, Yong Zhong, Wenxiu Liu, Tao Hong, Tao Song +7 more | 2024-06-04 |
| 11861320 | Text reduction and analysis interface to a text generation modeling system | Marcin Gajek, Divyanshu Murli, Ryan Walker, Walter DeFoor, Javed Qadrud-Din | 2024-01-02 |