Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11881548 | Electronic device, semiconductor device, packaging structure, bracket and method of manufacturing the bracket | Weiyun Wang, Xinqiang WANG, Yongde Li, Houjin Wang, Ye Yuan +1 more | 2024-01-23 |