Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11946504 | Assemblies, riveted assemblies, methods for affixing substrates, and methods for mixing materials to form a metallurgical bond | Scott A. Whalen, Tianhao Wang, Keerti S. Kappagantula | 2024-04-02 |
| 11903027 | Systems and methods for reducing occurrence of data collisions in wireless networks | Sarvesh Kumar Varatharajan, Arun Vijayakumari Mahasenan, Venkateswara Rao Manepalli, Won-soo Kim, Yaranama Venkata Ramana Dass +2 more | 2024-02-13 |