Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12104083 | Epoxy resin-based cathodic electrodeposition (CED) of metal components as an adhesion promoter for PU systems | Andreas Horstmann, Maximilian Maier | 2024-10-01 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12104083 | Epoxy resin-based cathodic electrodeposition (CED) of metal components as an adhesion promoter for PU systems | Andreas Horstmann, Maximilian Maier | 2024-10-01 |