Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11971845 | DSP encapsulation | Christopher N. Peters, Daniel L. Stanley, Umair Aslam, Elizabeth J. Williams, Angelica Sunga | 2024-04-30 |
| 11861181 | Triple modular redundancy (TMR) radiation hardened memory system | Richard J. Ferguson, Daniel L. Stanley | 2024-01-02 |