Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12101871 | Circuit board using thermocouple to dissipate generated heat and method for manufacturing the same | Huan He, Mei-Hua Huang, Biao Li | 2024-09-24 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12101871 | Circuit board using thermocouple to dissipate generated heat and method for manufacturing the same | Huan He, Mei-Hua Huang, Biao Li | 2024-09-24 |