Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12145515 | Heat dissipation structure for wire harness | Takahiro Nishiyama, Kei Yoshikawa | 2024-11-19 |
| 12089375 | Circuit assembly with bus bar and elastic heat conductive member | — | 2024-09-10 |