Issued Patents 2024
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12127338 | Semi-flex component carrier with dielectric material surrounding an embedded component and having locally reduced young modulus | Nick Xin, Seok Kim Tay | 2024-10-22 |
| 12058810 | Semi-flex component carrier with dielectric material having high elongation and low young modulus | Nick Xin, Seok Kim Tay | 2024-08-06 |
| 12048101 | Component carrier with well-defined outline sidewall cut by short laser pulse and/or green laser | Seok Kim Tay | 2024-07-23 |
| 12041730 | Component carrier with low-solvent fiber-free dielectric layer | Seok Kim Tay, Kim Liu | 2024-07-16 |
| 11963310 | Component carrier having component covered with ultra-thin transition layer | Seok Kim Tay, Kim Liu, Artan Baftiri, Henry Guo | 2024-04-16 |