Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12167529 | Heat removal architecture for stack-type component carrier with embedded component | — | 2024-12-10 |
| 12052824 | Component carriers connected by staggered interconnect elements | Jens Riedler, Christopher D. Hermann | 2024-07-30 |
| 12009315 | Component carrier structure connectable by electrically conductive connection medium in recess with cavity having surface profile | — | 2024-06-11 |