Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11963308 | Method for increasing adhesion strength between a surface of copper or copper alloy and an organic layer | Norbert Lützow, Wonjin Cho, Toshio Honda, Dirk Tews, Markku LAGER +4 more | 2024-04-16 |