Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12040282 | Electronic device including interposers bonded to each other | Justin Sato, Bomy Chen, Anu Ramamurthy | 2024-07-16 |
| 11935824 | Integrated circuit package module including a bonding system | Justin Sato, Bomy Chen, Yaojian Leng | 2024-03-19 |