Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11955347 | Encapsulation process for double-sided cooled packages | Teng Hock Kuah, Yi Lin, Ravindra RAGHAVENDRA, Kar Weng Yan | 2024-04-09 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11955347 | Encapsulation process for double-sided cooled packages | Teng Hock Kuah, Yi Lin, Ravindra RAGHAVENDRA, Kar Weng Yan | 2024-04-09 |