Issued Patents 2024
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12130248 | Heat source simulation structure | Xiao ZHAO, Chun-Lin Mao | 2024-10-29 |
| 11976884 | Flexible two-phase conversion heat transfer device | Xiao-Xiang Zhou, Shi-Lei Wei | 2024-05-07 |
| 11946699 | Bendable vapor chamber structure | — | 2024-04-02 |
| 11879690 | Flexible wick structure and deformable heat-dissipating unit using the same | — | 2024-01-23 |
| 11874067 | Heat dissipation unit with axial capillary structure | — | 2024-01-16 |
| 11864349 | Vapor chamber with structure for enhancing two-phase flow boiling | Chunlin Mao, Xiao-Xiang Zhou, Xingxing Zhang | 2024-01-02 |