Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12170185 | Vacuum deposition into trenches and vias and etch of trenches and via | — | 2024-12-17 |
| 12157942 | Versatile vacuum deposition sources and system thereof | — | 2024-12-03 |
| 12154770 | Vacuum deposition into trenches and vias | — | 2024-11-26 |
| 12106924 | Inverted cylindrical magnetron (ICM) system and methods of use | Tianzong Xu, Oahn Nguyen | 2024-10-01 |