Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11976171 | Polyimide resin precursor, polyimide resin, metal-clad laminated board, laminate, and flexible printed wiring board | Yoshinori Sato, Yoshihiko Konno | 2024-05-07 |
| 11946143 | Laminate | Kenji Nakamura, Yoshihiko Konno, Makoto Tai, Shuichi Fujita | 2024-04-02 |