Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12094726 | Adapting electrical, mechanical, and thermal properties of package substrates | Mukhles SOWWAN, Samer Banna, Omkaram Nalamasu, Gary E. Dickerson | 2024-09-17 |
| 12001193 | Apparatus for environmental control of dies and substrates for hybrid bonding | Ying Wang, Xundong Dai, Guan Huei See, Ruiping Wang, Michael R. Rice +1 more | 2024-06-04 |