HW

Hsiu-Jen Wang

Applied Materials: 1 patents #861 of 1,809Top 50%
Overall (2024): #440,192 of 561,600Top 80%
1
Patents 2024

Issued Patents 2024

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
12032284 Advanced-packaging high-volume-mode digital-lithography-tool Shih-Hao Kuo, Ulrich Mueller, Jang Fung Chen 2024-07-09