Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12154828 | Semiconductor device having a 2-D material layer including a channel region and source/drain regions and method for forming the same | Chiung-Yuan Lin, Tsung-Fu Yang, Weicheng Chu, Ching-Liang Chang, Chen-Han Chou +4 more | 2024-11-26 |
| 12085161 | Vehicle driveline component with weldment having air pocket configured to shift residual stress in weldment away from the weld joint | Anoop Vasu, Shizhu Xing, Jifa Mei, Ravi Desai | 2024-09-10 |