Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12148730 | In-process wire bond testing using wire bonding apparatus | Ben Carlson-Sypek, Ryan J. Simpson | 2024-11-19 |
| 12100864 | Continuous wire bonds for battery module | James Hawkins, Ryan J. Simpson, Ben Carlson-Sypek | 2024-09-24 |