Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12132028 | Semiconductor package with capacitance die | Thomas A. Volpe | 2024-10-29 |
| 12066964 | Highly available modular hardware acceleration device | Diwakar Urjan Anandakumar | 2024-08-20 |
| 12033960 | Semiconductor package with stiffener ring having elevated opening | — | 2024-07-09 |
| 11923347 | Semiconductor package with multiple interposers on a single substrate | — | 2024-03-05 |