Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12087659 | Electronic power package and heat sink/cold rail arrangement | Binghua Pan, David W. Ihms | 2024-09-10 |
| 12063739 | Printed circuit board and fabrication thereof | Kok Wee Yeo, Andreas Aye | 2024-08-13 |