Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11935855 | Electronic package structure and method for manufacturing the same | Wei Wang, Tung Yao LIN | 2024-03-19 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11935855 | Electronic package structure and method for manufacturing the same | Wei Wang, Tung Yao LIN | 2024-03-19 |