Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12159821 | Electronic package and manufacturing method thereof | Yih-Jenn Jiang, Don-Son Jiang | 2024-12-03 |
| 11973036 | Semiconductor package structure and method of manufacturing the same | — | 2024-04-30 |