Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11978706 | Electronic package structure, electronic substrate and method of manufacturing electronic package structure | Pei-Jen Lo | 2024-05-07 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11978706 | Electronic package structure, electronic substrate and method of manufacturing electronic package structure | Pei-Jen Lo | 2024-05-07 |