Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12050350 | Semiconductor package structure and method of manufacturing the same | Yu-Yuan Yeh, Jun-Wei Chen | 2024-07-30 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12050350 | Semiconductor package structure and method of manufacturing the same | Yu-Yuan Yeh, Jun-Wei Chen | 2024-07-30 |