Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12165979 | Packaging substrate and semiconductor apparatus comprising same | Sungjin Kim, Jincheol KIM, Byungkyu Jang | 2024-12-10 |
| 12027454 | Packaging substrate having electric power transmitting elements on non-circular core via of core vias and semiconductor device comprising the same | Sungjin Kim, Jincheol KIM | 2024-07-02 |
| 11981501 | Loading cassette for substrate including glass and substrate loading method to which same is applied | Sungjin Kim, Jincheol KIM, Byungkyu Jang | 2024-05-14 |
| 11967542 | Packaging substrate, and semiconductor device comprising same | Sungjin Kim, Jincheol KIM, Byungkyu Jang | 2024-04-23 |