Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12152179 | Electrically conductive adhesive | Jing Fang, Dong Yang | 2024-11-26 |
| 12129411 | Electrically conductive bonding tape with low passive intermodulation | Jeongwan Choi, Marina M. Kaplun, Steven Y. Yu, Jinbae Kim | 2024-10-29 |