Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11901608 | Chip-package-antenna integrated structure based on substrate integrated waveguide (SIW) multi-feed network | Zongming Duan, Yuefei Dai | 2024-02-13 |
| 11894601 | Millimeter-wave radar package module | Zongming Duan, Ying LIU, Bowen Wu, Weiwei Jin, Bingfei Dou +1 more | 2024-02-06 |