Issued Patents 2023
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11756899 | Lead frame surface finishing | Jürgen Barthelmes, Din-Ghee Neoh | 2023-09-12 |
| 11640931 | Die attachment method and material between a semiconductor device and die pad of a leadframe | — | 2023-05-02 |
| 11610849 | Method of manufacturing semiconductor devices, corresponding apparatus and semiconductor device | — | 2023-03-21 |