Issued Patents 2023
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11842948 | SMDs integration on QFN by 3D stacked solution | Fulvio Vittorio Fontana | 2023-12-12 |
| 11810839 | Semiconductor package with die stacked on surface mounted devices | — | 2023-11-07 |
| 11705388 | Assortment of substrates for semiconductor circuits, corresponding assortment of devices and method | Giovanni Graziosi | 2023-07-18 |