Issued Patents 2023
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11756874 | Electronic device comprising a chip and at least one SMT electronic component | Claire Laporte, Deborah COGONI, Laurent Schwartz | 2023-09-12 |
| 11557566 | Method for forming an electrical connection between an electronic chip and a carrier substrate and electronic device | Asma HAJJI, Fabien Quercia, Jerome Lopez | 2023-01-17 |