Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11600648 | Apparatuses and packages including a semiconductor substrate with a plurality of photoelectronic conversion regions and a transparent substrate | Takaaki Hirano, Shinji Miyazawa, Kensaku Maeda, Shunsuke FURUSE, Yutaka Ooka | 2023-03-07 |
| 11594563 | Image sensor having improved dicing properties | Atsushi Yamamoto, Shinji Miyazawa, Yutaka Ooka, Kensaku Maeda, Naoki Ogawa +4 more | 2023-02-28 |
| 11543621 | AF module, camera module, and electronic apparatus | Munekatsu Fukuyama, Hiroyasu Matsugai, Hiroyuki Itou, Suguru SAITO, Keiji Ohshima +7 more | 2023-01-03 |